At present, electronic devices have selected built-in antennas for the appearance of antennas. That is to say, compared with external antennas, built-in antennas such as PCB antennas, FPC antennas, and LDS antennas have their own special advantages. The mainstream built-in antennas include PCB antennas, fpc antennas, and LDS antennas, but these three are not particularly different, and each has its own advantages and applications. Today, wavelink will explain the characteristics of these three antennas.
Built-in antenna, FPC antenna, pcb antenna
1. PCB antenna
Various frequency bands, PCB board design and development
PCB antennas are widely used in single-band module circuit boards such as Bluetooth modules, WIFI modules, and ZIGBEE modules.
Advantages: The cost is not high, and there is no need to debug again after one debugging. The gain is relatively good.
Disadvantages: Suitable for a single frequency band, and there are also dual-band designs, such as dual-band WiFi.
It is equivalent to pulling out the antenna line on the PCB board and using other external metal as the antenna. Usually used in low-end mobile phones and smart hardware products with complex frequency bands.
Advantages: Applicable to almost all small electronic products, with good performance and relatively low cost.
Disadvantages: It needs to be debugged separately according to each product.
Three, LDS antenna
The LDS antenna is an evolved version of the FPC antenna, with extremely high space utilization. The FPC line is stamped out, and it must be flat, and complex shapes cannot be stamped out. The FPC antenna is a whole plane, although it can be bent, it can't be made too complicated. The LDS antenna uses a laser to engrave the antenna's graphics, which is very suitable for applications with compact internal space.
Advantages: It can make full use of various irregular surfaces in the three-dimensional space and reduce the size of the antenna.
Disadvantages: The price is more expensive, an order of magnitude more expensive than the FPC antenna, and there are many special requirements for the process of the outer surface of the product.